Friday, 31 May 2013

NEW Fujitsu Mini-ITX motherboard based on the latest AMD Embedded G-Series SOC Platform

We can confirm that Fujitsu Technology Solutions are  developing  a new Mini-ITX Motherboard called the D3313-S for 24/7 continuous operation in an extended temperature range of 0 to 60 degrees Celsius. The board from Fujitsu’s Industrial Series will be optimised for a wide range of industrial and semi-industrial applications and will have a product lifecycle of at least five years.

It is based the new AMD Embedded G-Series system on chip (SOC), which was developed especially for industrial applications. Following the official worldwide launch of the AMD Embedded G-Series SOC Platform on 23 April, 2013, the Fujitsu developers at the Augsburg plant have started design work on the boards. The first samples of the motherboard will be available in September 2013. Volume production in Augsburg is scheduled to begin in November 2013.

The use of systems on a chip (SOC) enables increased computing performance at a low energy consumption level. The D3313-S will be available in three versions, each with a different system on a chip (SOC) by AMD. D3313-S1 is based on AMD Embedded GX-210HA SOC with AMD Radeon HD8210E Graphics (Dualcore, 1.0 GHz), D3313-S2 is based on AMD Embedded GX-217GA SOC with AMD Radeon HD 8280E Graphics (Dualcore, 1.65 GHz), and D3313-S3 is based on AMD Embedded GX-420CA SOC with AMD Radeon HD 8400E Graphics (Quadcore, 2.00 GHz). Each version is equipped with two DDR3-1866/1600-SDRAM SO-DIMM sockets for up to 16 GB single-channel memory.

All new Fujitsu motherboards based on AMD Embedded G-Series SOC support DVI-I, Display Port, and 24-bit dual-channel LVDS. Furthermore, all boards in the D3313-S series come with an m-SATA port and a PCIe Minicard socket supporting USB. The layout of the external I/O ports is identical with that of D3003-S, the preceding generation. This makes it possible to fit the D3313-S into Fujitsu’s existing Mini-ITX housing. The resulting possibility of easily changing platform technologies while retaining the same housing is set to offer optimum conditions for realising cost-efficient systems for years to come.

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